Base station device

ABSTRACT

An external container is divided into IF unit  120  as a first flat-type external container that holds T-PA unit  140  provided with transmission power amplifier T-PA which amplifies transmission and reception signals and that is fixed to an installation place, and MDE unit  110  as a second flat-type external container that holds a circuit board of modulation and demodulation equipment (MDE) which modulates and demodulates transmission and reception signals and that is detachably attached to the first external container, MDE unit  110  is disposed on the outside of IF unit  120  with heat dissipation space provided therebetween, and a fin as a radiating member is provided on each of opposite faces of IF unit  120  and MDE unit  110.

TECHNICAL FIELD

The present invention relates to a base station in a communicationsystem, and more particularly, to a base station suitable for use as aradio base transceiver station in a 3rd generation mobile communicationsystem.

Further, the present invention relates to a motherboard on which isprovided a plurality of motherboard connectors connected to respectiveprinted-circuit board connectors provided on a plurality ofprinted-circuit boards, and more particularly, to a motherboard and abase station suitable for use in a radio base transceiver station in acommunication system.

BACKGROUND ART

In recent years, with rapid increases in cellular telephone subscriber,prompt expansion has been required of a communication area of a mobilecommunication system capable of supporting demand for not only speechcommunications but also other service such as data, music and image. Asis well known, expansion of a communication area of the mobilecommunication system is carried out by installing a BTS (BaseTransceiver Station) in a blind zone which communication signals do notreach.

As a radio base transceiver station (hereinafter, simply referred to asa “base station”) of the mobile communication system, in general, a lotof heavy large-size base stations are used each of which is comprised ofan external container (or rack) with a height of almost two meters orless storing various equipment, and has a large capacity of severalhundred to several thousand channels (for example, see JP 2001-111436).

FIG. 1 is a perspective view showing an appearance of an example of aconventional large-capacity base station. Base station 10 as shown inFIG. 1 has a structure where rack 11 with a height of 1,800 mm, width of800 mm and depth of 600 mm stores various equipment such as T-PA(Transmission Power Amplifier) 12, T-PA fan 13, MDE (Modulation andDemodulation Equipment) 14 and MDE fan 15.

Conventionally, in the case of installing this kind of large-scale basestation outside, for example, the land of about 100 m² is reserved toform a foundation, a main body of a base station is mounted on thefoundation using heavy equipment, the base portion is fixed usinganchors to install, and then, the base station is fenced to protect.Therefore, in order to expand a communication area by installing such alarge-scale base station in a blind zone, a great deal of introductorycost and running cost is required.

However, in the case of expanding a communication area by installing theconventional large-scale base station in a blind zone such as amountainous area having a small number of subscribers as compared withurban areas having a large number of subscribes, since a possibility ishigh that a high use rate is not expected unlike urban areas, reductionin introductory cost and running cost becomes significant issues.

As one of means for solving such issues, for example, it is consideredinstalling a large-capacity base station conventionally in an urban areawith a large number of subscribers, while installing arelatively-inexpensive small-size small-capacity base station in a blindzone such as a mountainous area with a relatively small number ofsubscribers, and thereby expanding a communication area whilesuppressing increases in introductory cost and running cost of theentire system.

However, in such a conventional type of base station, for example, evenin the case of constituting an extremely small-size and small-capacitybase station using a single BB (Base Band signal processor) board withseveral ten channels, the weight and size of the base station bodybecome significantly great.

Therefore, even when a communication area is expanded using such asmall-capacity base station, construction for installation requiresmachinery and materials to some extent and several operators. Inparticular, when a base station is placed in a mountainous area suchthat a construction vehicle cannot reach a target place, it is necessaryto carry machinery and materials for installation and a base stationbody by hands, thereby requiring more manpower and time.

Accordingly, in the case of expanding a communication area using aconventional small-capacity base station that is merely miniaturized, arisk is high of not sufficiently expecting decreases in introductorycost and easy and prompt expansion of communication area.

Meanwhile, this type of base station often causes an initial failure atthe time of installation. A delay in service of communication channelsdue to such a failure becomes a cause of delaying a setup of the entirecommunication system and creating great disadvantages.

Therefore, when such a failure occurs, in general, in stead of repairinga base station with the failure occurring, construction is carried outfor exchanging the station with a new base station to restorecommunication channels promptly.

However, such construction for exchanging base stations is operation forremoving the base station with the failure occurring, and theninstalling a base station for exchange. Therefore, such exchangeconstruction requires effort and time almost twice more than that in newconstruction for newly installing a base station.

As described above, this type of conventional base station requiresenormous cost and effort for the installation.

Meanwhile, this type of base station has such a structure that aplurality of printed-circuit boards is provided in an external containersuch as the main body unit or detachable unit in such a way thatrespective printed-circuit board connectors provided in theprinted-circuit boards are connected to a plurality of motherboardconnectors of a motherboard attached to the external container.

In the motherboard in this type of conventional base station, thedirection for attaching the plurality of printed-circuit boards to theexternal container is perpendicular to the direction for connecting therespective printed-circuit board connectors of the plurality ofprinted-circuit boards to the plurality of motherboard connectors of themotherboard.

Therefore, in the conventional motherboard, when the printed-circuitboards are attached to the external container in such a state that themotherboard connectors are connected to the respective printed-circuitboard connectors of the plurality of printed-circuit boards, largestress is imposed on the printed-circuit boards due to errors inplacement positions between the motherboard connectors andprinted-circuit board connectors, and there arises a risk that theprinted-circuit boards tend to cause a failure due to the stress.

DISCLOSURE OF INVENTION

It is a first object of the present invention to provide a base stationenabling itself to be installed in a desired installation positionreadily and promptly, and further enabling great reduction inintroductory cost.

It is a second object of the present invention to provide a motherboardenabling a printed-circuit board to be attached to an external containerwithout imposing stress on the printed-circuit board with a motherboardconnector connected to a printed-circuit board connector.

In order to achieve the first object, in a base station of the presentinvention, an external container is divided into a first flat-typeexternal container that is fixed to an installation place and a secondflat-type external container that holds circuit boards and that isdetachably attached to the first external container, and the secondexternal container is disposed on the outside of the first externalcontainer with heat dissipation space provided therebetween.

Further, a base station of the present invention has a first flat-typeexternal container that is fixed to an installation place, and a secondflat-type external container that holds a plurality of stacked circuitboards and that is detachably attached to the first external container,where clearance for heat dissipation communicating with outside air isprovided between the first external container and the second externalcontainer, and the first external container and the second externalcontainer are provided opposite to each other in the direction in whichthe circuit boards are laminated.

Furthermore, in order to achieve the second object, a motherboard of thepresent invention is provided with a plurality of motherboard connectorsconnected to respective printed-circuit board connectors provided in aplurality of printed-circuit boards attached to the external container,and is configured in such a manner that the direction ofattaching/detaching the printed-circuit board connectors to/from themotherboard connectors is the same as the direction of attaching theprinted-circuit boards to the external container.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic perspective view showing an appearance of aconventional base station;

FIG. 2 is a block diagram illustrating a configuration of a base stationaccording to one embodiment of the present invention;

FIG. 3 is a perspective view showing an appearance of the base stationaccording to the one embodiment of the present invention;

FIG. 4 is a perspective view showing an appearance of disassembled eachunit of the base station according to the one embodiment of the presentinvention;

FIG. 5 is a perspective view showing an appearance of a disassembled MDEunit of the base station according to the one embodiment of the presentinvention;

FIG. 6 is a perspective view showing an appearance of a disassembledelectronic circuit board of the MDE unit of the base station accordingto the one embodiment of the present invention;

FIG. 7 is a perspective view showing an appearance of the disassembledelectronic circuit board of the MDE unit of the base station, as viewedfrom the back side in FIG. 6, according to the one embodiment of thepresent invention;

FIG. 8 is a front view of the base station according to the oneembodiment of the present invention;

FIG. 9 is a sectional view taken along line a-a of FIG. 8;

FIG. 10 is a sectional view taken along line b-b of FIG. 8;

FIG. 11 is a sectional view taken along line c-c of FIG. 8;

FIG. 12 is a sectional view taken along line d-d of FIG. 8;

FIG. 13 is a sectional view taken along line e-e of FIG. 8;

FIG. 14 is a disassembled perspective view showing a state in attachinga T-PA unit to an IF unit of the base station according to the oneembodiment of the present invention;

FIG. 15 is a disassembled perspective view showing a state in attachingthe MDE unit to the IF unit of the base station according to the oneembodiment of the present invention;

FIG. 16 is a perspective view showing a state where the MDE unit isattached to the IF unit of the base station according to the oneembodiment of the present invention;

FIG. 17 is an enlarged perspective view of a connector portion of the IFunit of the base station according to the one embodiment of the presentinvention;

FIG. 18 is a perspective view showing a state in opening a FAN cover andattaching the FAN unit of the base station according to the oneembodiment of the present invention;

FIG. 19 is an enlarged partial perspective view showing a state inopening the FAN cover and attaching the FAN unit to a FAN unit storageportion of the base station according to the one embodiment of thepresent invention;

FIG. 20 is an enlarged partial perspective view showing a state wherethe FAN cover is opened and the FAN unit is attached to the FAN unitstorage portion of the base station according to the one embodiment ofthe present invention;

FIG. 21 is an enlarged partial perspective view showing a state inopening the FAN cover and connecting the FAN unit attached to the FANunit storage portion to a terminal board of the base station accordingto the one embodiment of the present invention;

FIG. 22 is a perspective view showing a state prior to locking an MDEcase and an MDE cover of the MDE unit of the base station according tothe one embodiment of the present invention;

FIG. 23 is a perspective view showing a state in locking the MDE caseand the MDE cover of the MDE unit of the base station according to theone embodiment of the present invention;

FIG. 24 is a perspective view showing a state prior to locking the MDEunit and the IF unit after locking the MDE case and the MDE cover of theMDE unit of the base station according to the one embodiment of thepresent invention;

FIG. 25 is a perspective view showing a state in locking the MDE unitand the IF unit after locking the MDE case and the MDE cover of the MDEunit of the base station according to the one embodiment of the presentinvention;

FIG. 26 is a perspective view showing a state subsequent to locking theMDE unit and the IF unit after locking the MDE case and the MDE cover ofthe MDE unit of the base station according to the one embodiment of thepresent invention;

FIG. 27 is a perspective view showing the back of the base stationaccording to the one embodiment of the present invention;

FIG. 28 is a perspective view showing a state prior to attaching mainbody fixing members to the back of the base station according to the oneembodiment of the present invention; and

FIG. 29 is a perspective view showing a state subsequent to attachingthe main body fixing members to the back of the base station accordingto the one embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

A base station of the present invention adopts a configuration where anexternal container is divided into a first flat-type external containerthat is fixed to an installation place and a second flat-type externalcontainer that holds circuit boards and that is detachably attached tothe first external container, and the second external container isdisposed on the outside of the first external container with heatdissipation space provided therebetween.

By this means, in this base station, since the external container isdivided, each part of the external container becomes small in size andthe operability is improved. Further, in this base station, since thesecond external container is disposed on the outside of the firstexternal container with heat dissipation space provided therebetween,the heat dissipation characteristics are extremely improved.Furthermore, in this base station, since the heat dissipationcharacteristics of each external container is improved, it is possibleto further reduce the size and weight.

Moreover, the base station of the present invention adopts aconfiguration where a radiating member is provided on each of oppositefaces of the first external container and the second external container.

By this means, in this base station, since a radiating member isprovided on each of opposite faces of the first external container andthe second external container, the hear dissipation characteristics arefurther improved.

The base station of the present invention further adopts a configurationwhere the first external container holds a power supply.

By this means, in this base station, since the first external containerfixed to the installation place holds a power supply which hardly causesa failure and is connected to an external cable, it is only required toexchange the second external container under failure of the circuitboard, thereby enabling prompt restoration.

The base station of the present invention further adopts a configurationwhere the first external container and the second external containereach have the airtightness, while communicating with each other ininternal space thereof.

By this means, in this base station, since the first external containerand the second external container each have the airtightness, whilecommunicating with each other in internal space thereof, it is possibletomaintain respective internal temperatures of the external containersuniformly, and it is possible to suppress occurrence of failures due tolocal heating.

The base station of the present invention further adopts a configurationwhere the first external container is provided on its upper face with afan unit to absorb the air from between the first external container andthe second external container to discharge.

By this means, in this base station, since the air between the firstexternal container and the second external container is absorbed anddischarged by the fan unit, it is possible to forcibly cool the firstexternal container and the second external container. Since the air (hotair) ascends in behavior and the fan unit is provided on the upper faceof the first external container, it is possible to efficiently dischargethe air (hot air) from between the first external container and thesecond external container.

The base station of the present invention further adopts a configurationprovided with a motherboard in which is provided a plurality ofmotherboard connectors connected to respective printed-circuit boardconnectors provided in a plurality of printed-circuit boards, and whichis configured so that the direction of attaching/detaching theprinted-circuit board connectors to/from the motherboard connectors isthe same as the direction of attaching the printed-circuit boards to theexternal container.

By this means, in this base station, since the direction ofattaching/detaching the printed-circuit board connectors to/from themotherboard connectors is the same as the direction of attaching theprinted-circuit boards to the external container, it is possible toattach the printed-circuit boards to the external container in such astate that the printed-circuit board connectors are attached to themotherboard connectors, without imposing stress on the printed-circuitboards. Accordingly, in this base station, it is possible to construct acommunication system where a failure hardly occurs due toattaching/detaching of the printed-circuit boards.

The base station of the present invention further adopts a configurationprovided with a cooling fan to control the temperature inside theexternal container to which the motherboard is attached, whereprinted-circuit boards with small areas are provided in a centralportion of the external container among a plurality of printed-circuitboards attached to the motherboard, and a ventilation path of thecooling fan is formed between the printed-circuit boards with smallareas and the external container.

By this means, in this base station, since printed-circuit boards withsmall areas are provided in a central portion of the external container,and a ventilation path of the cooling fan is formed between theprinted-circuit boards with small areas and the external container, itis possible to efficiently cool each of the printed-circuit boardsprovided inside the external container by the cooling fan, and tosuppress occurrence of failures in each of the printed-circuit boardsdue to heat.

The base station of the present invention further adopts a configurationprovided with a radiating member that cools at least one of theplurality of printed-circuit boards in a state where the plurality ofprinted-circuit board connectors are connected to the plurality ofmotherboard connectors.

By this means, in this base station, since at least one of the pluralityof printed-circuit boards is cooled by the radiating member in a statewhere the plurality of printed-circuit board connectors are connected tothe plurality of motherboard connectors, it is possible to furthersuppress occurrence of failures in each of the printed-circuit boardsdue to heat. In addition, it is also possible to cancel the stress inthe case where the motherboard is not used, respective printed-circuitboard connectors of a plurality of printed-circuit boards are connectedto overlap one another, and the printed-circuit boards are attached tothe external container. However, in such a configuration, since thenumber of pins increases for buses of the printed-circuit boardconnectors and intervals between the printed-circuit boards decrease, itbecomes difficult to provide the radiating member, and an inconvenienceoccurs such that the heat dissipation characteristics deteriorate ineach of the printed-circuit boards. In contrast thereto, in this basestation, since printed-circuit board connectors are connected using themotherboard, it is possible to decrease the number of pins for buses ofthe printed-circuit boards, and increase intervals between theprinted-circuit boards freely. Therefore, the versatility is improved inprovision of the radiating member, and it is possible to also improvethe heat dissipation characteristics in each printed-circuit board.

The base station of the present invention further adopts a configurationwhere the radiating member has a heat pipe.

By this means, in this base station, since the radiating member has aheat pipe, it is possible to further improve the heat dissipationcharacteristics of the printed-circuit boards.

A base station of the present invention adopts a configuration providedwith a first external container that is fixed to an installation placeand a second external container that holds a plurality of stackedcircuit boards and that is detachably attached to the first externalcontainer, where clearance for heat dissipation communicating withoutside air is provided between the first external container and thesecond external container, and the first external container and thesecond external container are provided opposite to each other in thedirection in which the circuit boards are laminated.

By this means, in this base station, since the first external containerand the second external container are provided opposite to each other inthe direction in which the circuit boards are laminated, the heatdissipation area communicating with outside air can be increased betweenthe first external container and the second external container, and thesecond external container can be formed in a flat and small shape.

A motherboard of the present invention is a motherboard in which isprovided a plurality of motherboard connectors connected to respectiveprinted-circuit board connectors provided in a plurality ofprinted-circuit boards attached to an external container, and which isconfigured so that the direction of attaching/detaching theprinted-circuit board connectors to/from the motherboard connectors isthe same as the direction of attaching the printed-circuit boards to theexternal container.

By this means, in this motherboard, since the direction ofattaching/detaching the printed-circuit board connectors to/from themotherboard connectors is the same as the direction of attaching theprinted-circuit boards to the external container, it is possible toattach the printed-circuit boards to the external container withoutimposing stress on the printed-circuit boards, in such a state that theprinted-circuit board connectors are attached to the motherboardconnectors.

The motherboard of the present invention further adopts a configurationwhere the plurality of printed-circuit boards is a CNT boardconstituting a control device in modulation and demodulation equipmentto modulate and demodulate transmission and reception signals, a TRXboard constituting a transmission and reception card, a BB0 board forstandard equipment constituting a baseband signal processor, and a BB1board for expansion constituting a baseband signal processor.

The CNT board, TRX board, BB0 board and BB1 board often cause infantmortality failures in installation. In the case where such aprinted-circuit board causes a failure due to the stress at the time ofattaching thereof to the external container, it is difficult toimmediately determine a cause of the failure, and such a possibility isextremely high that when a new printed-circuit board is attached toexchange, the exchanged printed-circuit board immediately causes thesame failure again. In this motherboard, since such variousprinted-circuit boards are attached to the external container using themotherboard, it is possible to prevent occurrence of failures of theprinted-circuit boards due to the stress in attaching the boards to theexternal container. Accordingly, in this motherboard, when a newprinted-circuit board is attached to exchange, it does not happen thatthe exchanged printed-circuit board immediately causes the same failuredue to the stress.

The motherboard of the present invention further adopts a configurationwhere the external container is comprised of an external container caseand an external container cover attached to the external container caseto be openable and closable, and the BB1 board for expansion is providedin a portion exposed in a state where the external container cover isopened.

By this means, in this motherboard, since the BB1 board for expansion isprovided in a portion exposed in a state where the external containercover is opened, it is possible to perform the operation of attaching ordetaching the BB1 board for expansion with ease.

One embodiment of the present invention will specifically be describedbelow with reference to accompanying drawings. FIG. 2 is a block diagramillustrating a configuration of a base station according to oneembodiment of the present invention. FIG. 3 is a perspective viewshowing an appearance of the base station according to the oneembodiment of the present invention. FIG. 4 is a perspective viewshowing an appearance of disassembled each unit of the base stationaccording to the one embodiment of the present invention.

As shown in FIGS. 2 to 4, base station 100 according to the oneembodiment of the present invention has a configuration with broadlydivided four units, MDE unit 110 as the second external container, IFunit 120 as the first external container, FAN unit 130 and T-PA unit140.

MDE unit 110 is provided with modulation and demodulation equipment(MDE) that performs modulation and demodulation of transmission andreception signals. IF unit 120 is provided with an interface for adevice connected to external cables 150 (see FIG. 17) such ascommunication cables. FAN unit 130 is provided with a cooling fan as aheat exchanger that cools internal devices of base station 100. T-PAunit 140 is provided with a transmission power amplifier (T-PA) thatamplifies transmission and reception signals.

As shown in FIGS. 2, 5, 6 and 7, MDE unit 110 has CNT board P1 comprisedof a printed-circuit board constituting a control device, TRX board P2comprised of a printed-circuit board constituting a transmission andreception card, BB0 board P3 comprised of a printed-circuit board forstandard equipment constituting a baseband signal processor, BB1 boardP4 comprised of a printed-circuit board for expansion constituting abaseband signal processor, motherboard 111 on which these electroniccircuit boards are mounted, terminal board 112 mounted on motherboard111, and MDE fan 113 as a heat exchanger that controls the internaltemperature of MDE unit 110.

As shown in FIG. 2, IF unit 120 has terminal board 121 to which externalcables 150 are connected, power supply device 122 that supplies thepower to terminal board 121 and MDE 110, and duplexer 123 connected toan antenna.

As shown in FIG. 4, each of FAN unit 130 and T-PA unit 140 is comprisedof a single unit.

As shown in FIGS. 2, 6 and 7, CNT board P1 of MDE unit 110 is connectedto motherboard 111 via connector C1 thereof and connector C5 ofmotherboard 111. TRX board P2 is connected to motherboard 111 viaconnector C2 thereof and connector C6 of motherboard 111. BB0 board P3is connected to motherboard 111 via connector C3 thereof and connectorC7 of motherboard 111. BB1 board P4 is connected to motherboard 111 viaconnector C4 thereof and connector C8 of motherboard 111.

Motherboard 111 is connected to terminal board 112 via connector C9thereof and connector C10 of terminal board 112. Further, motherboard111 is connected to power supply device 122 of IF unit 120 via connectorC12 of MDE unit 110 and connector C15 of IF unit 120.

Terminal board 112 is connected to terminal board 121 of IF unit 120 viaconnector C11 of MDE unit 110 and connector C14 of IF unit 120. Further,terminal board 112 is connected to power supply device 122 of IF unit120 via connector C12 of MDE unit 110 and connector C15 of IF unit 120.

MDE fan 113 is connected to terminal board 112 of MDE unit 110.

FAN unit 130 is connected to terminal board 121 of IF unit 120.

T-PA unit 140 is connected to power supply device 122 and terminal board121 of IF unit 120 via connector C20 thereof and connector C17 of IFunit 120. T-PA unit 140 is further connected to TRX board P2 of MDE unit110 via connector C21 thereof, connector C18 of IF unit 120, connectorC16 of IF unit 120 and connector C13 of MDE unit 110. T-PA unit 140 isfurthermore connected to duplexer 123 of IF unit 120 via connector C22thereof and connector C19 of IF unit 120.

More specifically, as shown in FIGS. 5 to 7, MDE unit 110 has such aconfiguration that the waterproof-processed external container comprisedof MDE case 114 and MDE cover 115 holds therein CNT board P1, TRX boardP2, BB0 board P3, BB1 board P4, motherboard 111, terminal board 112 andMDE fan 113 as described above.

As shown in FIGS. 6 and 7, motherboard 111 is mounted on board plate 116via motherboard mounting hardware 117. Board plate 116 is formed ofsheet metal with high heat dissipation characteristics such as aluminum,and is screwed to MDE case 114.

Connectors C1, C2 and C4 respectively of CNT board P1, TRX board P2 andBB1 board P4 and connectors C5, C6 and C8 of motherboard 111 arearranged so that connectors are attached or detached in the directionperpendicular to the plate surface of board plate 116.

By this means, the direction in which CNT board P1, TRX board P2 and BB1board P4 are attached or detached is the same as the direction in whichboard plate 116 is screwed in MDE case 114. Therefore, in screwing boardplate 116 in MDE case 114, stress is not imposed on CNT board P1, TRXboard P2 and BB1 board P4, and an occurrence of infant mortality failureis prevented in attaching the boards.

In addition, BB0 board P3 is attached or detached in the directionparallel to the plate surface of board plate 116. However, connector C3of the board P3 is attached or detached to/from connector C7 ofmotherboard 111 beforehand positioned and attached to board plate 116,and therefore, stress is not imposed in attaching the board P3.

A specific structure where CNT board P1, TRX board P2, BB0 board P3 andBB1 board P4 are attached to MDE unit 110 is shown in each sectionalview in FIGS. 9, 10, 11, 12 and 13 respectively taken along lines a-a,b-b, c-c, d-d and e-e of FIG. 8.

The operation of attaching or detaching CNT board P1, TRX board P2, BB0board P3 and BB1 board P4 to/from MDE unit 110 is carried out in such astate that MDE cover 115 is opened which is attached to MDE case 114 tobe openable and closable with cover hinges 1151 and 1152 and case hinges1141 and 1142.

BB1 board P4 for expansion is preferably arranged in a portion exposedin such a state that MDE cover 115 is opened which is attached to MDEcase 114 to be opened and closed. In other words, since BB1 board P4 isprovided in such an exposed position, it is possible to readily performthe operation of attaching or detaching BB1 board P4 to/from MDE unit110.

Further, the operation of checking or adjusting CNT board P1, TRX boardP2, BB0 board P3 and BB1 board P4 is carried out in such a state thatsmall cover 1153 is opened which is attached to MDE cover 115 to beopenable and closable with cover hinges 1154 and 1155. In addition, inorder to secure the safety, small cover 1153 in a closed state isattached to MDE cover 115 using screws enabling attaching/detachingthereof only in using a specific tool.

In MDE unit 110, as shown in FIGS. 5 and 6, among CNT board P1, TRXboard P2, BB0 board P3 and BB1 board P4, CNT board P1 that is thelargest board is provided in a backmost portion of MDE case 114. TRXboard P2, BB0 board P3 and BB1 board P4 formed of small-sizeprinted-circuit boards with relatively small areas are provided in acentral portion of MDE case 114.

By this means, ventilation paths are formed between TRX board P2, BB0board P3 and BB1 board P4 formed of small-size printed-circuit boardsand an inner wall of MDE case 114 of MDE unit 110, and therefore, it ispossible to efficiently cool each of the printed-circuit boards providedinside MDE unit 110 by MDE fan 113, and to suppress occurrence offailures in each of the printed-circuit boards due to heat.

Further, MDE unit 110 is preferably provided with a radiating membersuch as, for example, a radiating sheet to cool at least one of CNTboard P1, TRX board P2, BB0 board P3 and BB1 board P4 provided in MDEunit 110.

By this means, in such a state that respective connectors of CNT boardP1, TRX board P2, BB0 board P3 and BB1 board P4 are connected tomotherboard connectors of motherboard 111, at least one of the boards iscooled by the radiating member, it is possible to further suppressoccurrence of failures in each printed-circuit board due to heat. Inaddition, a member provided with a heat pipe may be used as theradiating member. By using the heat pipe, it is possible to furtherimprove the heat dissipation characteristics of CNT board P1, TRX boardP2, BB0 board P3 and BB1 board P4.

IF unit 120 as described above is configured as a main body unit that isfirst positioned and placed in installing base station 100 in apredetermined installation portion. The other units, MDE unit 110, FANunit 130 and T-PA unit 140, are configured as detachable units which aredetachably attached to IF unit 120 that is the main body unit.

In other words, as shown in FIG. 14, T-PA unit 140 is screwed in IF unit120 while being mounted on a predetermined portion of IF unit 120 withchain-shaped grips 1401 attached to both side faces of the unit 140.Chain 1402 is attached to T-PA unit 140 to prevent the unit 140 fromfalling in attaching or detaching the unit 140. Chain 1402 is providedat its free end with hook 1403. Hooking hook 1403 on hook pin 1220 of IFunit 120 prevents falling of T-PA unit 140 in attaching or detaching theunit 140.

As shown in FIGS. 3, 4 and 5, MDE unit 110 is attached to IF unit 120 tobe openable and closable and detachable by engaging or removing MDE unithinge pins 1143 and 1144 formed on one side face of the unit 110respectively in/from IF unit hinges 1201 and 1202 formed on the sideface of IF unit 120 on the same side.

In MDE unit 110, as shown in FIGS. 15 and 16, in such a state that MDEunit hinge pin 1144 is engaged in IF unit hinge 1202 of IF unit 120,fall prevention cap 1404 is attached to IF unit 120 is mounted on afront end portion of MDE unit hinge pin 1144. Therefore, MDE unit 110 isprevented from falling from IF unit 120 accidentally, and safety isensured in the operation for opening and closing MDE unit 110.

In this way, when MDE unit 110 is mounted on IF unit 120 to be openableand closable and closed, connectors C11, C12 and Cl3 of MDE unit 110 areconnected to connectors C14, C15 and C16 of IF unit 120, respectively.

In addition, as shown in FIG. 17, small window 1204 is formed on theside portion of each of connectors C14, C15 and C16 of IF unit 120 tofacilitate the operation for connecting external cables 150 to equipmentprovided inside IF unit 120. As shown in FIGS. 14, 15 and 16, smallwindow 1204 is closed by protection cover 1205 after connecting externalcables 150 to the equipment provided inside IF unit 120. An operator isthereby prevented from erroneously touching a conductive wire ofexternal cables 150 and suffering an electric shock in attaching IF unit120 to an installation portion, or opening or closing MDE unit 110.

As shown in FIG. 18, FAN unit 130 is detachably stored in FAN unitstorage portion 1206 as a heat exchanger storage portion provided toextend above the portion of IF unit 120 where MDE unit 110 is attached.

As shown in FIGS. 15 and 16, FAN unit storage portion 1206 is closed byFAN cover 1203 when FAN unit 130 is stored. As a screw to fix FAN cover1203 to FAN unit storage portion 1206, a specific screw is used that isthe same as the screw to close small cover 1153. Further, as shown inFIG. 18, in FAN cover 1203, locking screw 1208 is provided at a free endof a protection chain to prevent accidental closing, and engaged inscrew hole 1209 on the side face of IF unit 120 in a state that FAN unitstorage portion 1206 is opened. In this way, an operator is preventedfrom being caught in clearance caused by FAN cover 1203 accidentallybeing closed, in attaching or detaching FAN unit 130 to/from FAN unitstorage portion 1206.

The operation for attaching or detaching FAN unit 130 to/from FAN unitstorage portion 1206 is carried out by grasping grip 1301 of FAN unit130. As shown in FIG. 19, channel-like formed guide rails 1210 areprovided on both side portions of FAN unit storage portion 1206.Meanwhile, FAN unit guides 1302 fitted with guide rails 1210 areprovided on both side portions of FAN unit 130.

Guide rails 1210 of FAN unit storage portion 1206 are provided to risetoward the front of FAN unit storage portion 1206. Therefore, when guiderails 1210 are fitted with FAN unit guides 1302 of FAN unit 130, asshown in FIG. 20, FAN unit 130 is stored in FAN unit storage portion1206 by weight thereof. In FAN unit 130 stored in FAN unit storageportion 1206, connection terminal 1303 thereof is connected toconnection terminal 1211 extending from terminal board 121 (see FIG.21).

Meanwhile, as shown in FIGS. 22, 23 and 24, MDE cover lock plate 1145 isprovided on the side face of MDE cover 114 on the open and close side ofMDE unit 110, as means for locking MDE cover 115 in MDE case 114 withMDE cover 115 closed.

As shown in FIG. 23, with MDE cover 115 closed, by inserting MDE coverlock key 1146 in key hole 1147 of MDE cover lock plate 1145 and rotatingthe key, MDE cover lock plate 1145 locks MDE cover 115 in MDE case 114,thereby reserving safety of MDE unit 110. In addition, as shown in FIG.24, key hole 1147 of MDE cover lock plate 1145 is closed by key holecover 1148 after locking to prevent rain, dust or the like from enteringthrough key hole 1147.

In the same way as the foregoing, as shown in FIGS. 24, 25 and 26, MDEunit lock plate 1212 is provided on the side face on the open and closeside of IF unit 120, as means for locking MDE unit 110 in IF unit 120with MDE unit 110 closed.

As shown in FIG. 25, with MDE unit 110 closed, by inserting MDE unitlock key 1213 in key hole 1214 of MDE unit lock plate 1212 and rotatingthe key, MDE unit lock plate 1212 locks MDE unit 110 in IF unit 120,thereby reserving safety of MDE unit 110, IF unit 120 and T-PA unit 140.In addition, as shown in FIG. 26, key hole 1214 of MDE unit lock plate1212 is closed by key hole cover 1215 after locking to prevent rain,dust or the like from entering through key hole 1214.

On the back of IF unit 120 that is the main body of base station 100configured as described above, as shown in FIGS. 27, 28 and 29,attaching portions 1216 and 1217 of main-body fixing members 160, 161and 162 are formed on the main body unit, and used in fixing IF unit 120to a predetermined installation portion (herein, a pole such as autility pole).

In this way, as shown in FIGS. 28 and 29, main-body fixing members 160,161 and 162 are fixed to attaching portions 1216 and 1217 on the back ofIF unit 120 using bolts 163 and 164, fixing bands 165 and 166 arerespectively passed through main-body fixing members 161 and 162, andthe fixing bands 165 and 166 are wound and tightened around the pole,whereby IF unit 120 is fixed to the pole.

Each of IF unit 120, MDE unit 110, FAN unit 130 and T-PA unit 140 ofbase station 100 configured as described above is configured to have aweight and size enabling a single person to carry the unit.

Herein, aforementioned “weight and size enabling a single person tocarry the unit” are difficult to specify because there are individualdifferences due to age, health condition, physical ability, etc of anoperator. In general, for example, as an average value for an adultoperator, it is assumed that the weight is 20 kg or less and that thesize (height, width and depth) is 600 mm or less.

Base station 100 according to this embodiment is divided into MDE unit110 and IF unit 120 as described above, and therefore, increases theheat radiation area of the entire base station. It is thus possible toreduce sizes and weights of MDE fan 113 and FAN unit 130 provided inbase station 100.

In other words, in base station 100, the base station body is broadlydivided into IF unit 120 as a main body unit and MDE unit 110 as adetachable unit each with the weight and size enabling a single personto carry the unit.

Accordingly, base station 100 can be installed by a single person in ablind zone considered as being difficult to install such as each floorof a building, underground city, and mountainous area, without requiringmanpower and special equipment and materials for installation. It isthus possible to install base station 100 without a great deal ofintroductory cost and expand a communication area readily and promptly.

Further, in base station 100, IF unit 120 as a main body unit storesequipment hardly causing failures connected to external cables 150 suchas power supply device 122 and duplexer 123, while MDE unit 110 as adetachable unit stores electronic circuit boards apt to cause infantmortality failures, setting errors and so on. Thus, according to basestation 100, for example, even when a failure occurs in an electroniccircuit board such as CNT board P1, TRX board P2, BB0 board P3, BB1board P4 and motherboard 111, it is possible to restore thecommunication system rapidly only by exchanging MDE unit 110, and toperform startup and maintenance of the communication system extremelyreadily and promptly.

Further, in base station 100, as shown in FIG. 12, only portions aroundconnection of connectors C11, C12 and C13 of MDE unit 110 as shown inFIG. 16 and connectors C14, C15 and C16 of IF unit 120 are sealed byseal member 180. In other words, MDE unit 110 and IF unit 120 are sealedso as to communicate with each other only in connection portions.Accordingly, base station 100 is capable of increasing heat radiationareas of opposite portions of MDE unit 110 and IF unit 120, and ofimproving the heat radiation effect. Further, according to thisconfiguration, as shown in FIG. 13, it is possible to form clearancecommunicating with outside air in the opposite portions except connectorportions of MDE unit 110 and IF unit 120. By forming such clearancecommunicating with outside air, it is possible to cause heat emittedfrom IF unit 120, in which are stored equipment with a high heatingvalue such as power supply device 122, not to directly transfer to MDEunit 110 in which are stored electronic circuit boards easy to suffereffects of heat. Furthermore, in base station 100, as shown in FIG. 15,radiating fins 110 a and 120 a arranged in the vertical direction asradiating members are respectively provided on opposite faces of MDEunit 110 and IF unit 120. In this way, in base station 100, clearancecommunicating with outside air is provided on opposite portions of MDEunit 110 and IF unit 120, heat dissipation space is thereby provided,and radiating fins 110 a and 120 a arranged in the vertical direction asradiating members are respectively provided on opposite faces of MDEunit 110 and IF unit 120, whereby the heat dissipation characteristicsare extremely improved.

Further, as shown in FIG. 12, base station 100 is configured in such away that open/close portions of IF unit 120 and MDE unit 110 are lockedby MDE unit lock plate 121 s as locking means with MDE unit 110 closed,and seal member 180 is thereby pressed by MDE unit 110 and IF unit 120.

Thus, according to base station 100, by repulsion force of seal member180 against pressure, play can be absorbed between MDE unit hinge pins1143 and 1144 provided in MDE unit 110 and IF unit hinges 1201 and 1202provided in IF unit 120, and it is thereby possible to suppressoccurrence of failures such as a contact failure in a connector portionof the electronic circuit board due to vibration of base station 100.

In addition, MDE case 114 and MDE cover 115 are sealed by seal member170, while IF unit 120 and T-PA unit 140 are sealed by seal member 190,on respective entire peripheries.

Connectors C14, C15 and C16 of IF unit 120 of base station 100 areconfigured to follow the open/close operation of MDE unit 110 withrespect to IF unit 120 and rotate to maintain connection positionrelationships between the connectors and connectors C11, C12 and C13,when connected or disconnected to/from connectors C11, C12 and C13 ofMDE unit 110. It is thus possible to smoothly perform the operation forconnecting or disconnecting connectors C14, C15 and C16 of IF unit 120to/from connectors C11, C12 and C13 of MDE unit 110.

As shown in FIGS. 15 and 16, FAN unit storage portion 1206 of basestation 100 has a structure of extending to a portion for preventing MDEunit 110 from moving in the direction in which MDE unit hinge pins 1143and 1144 are respectively removed from IF unit hinges 1201 and 1202,when MDE unit 110 rotates in the direction from an initial attachmentposition to IF unit 120 to the closing position.

In this way, when MDE unit 110 rotates in the direction from the initialattachment position to IF unit 120 to the closing position, MDE unit 110is prevented from moving in the direction in which MDE unit hinge pins1143 and 1144 are respectively removed from IF unit hinges 1201 and1202.

Thus, according to base station 100, it does not happen that MDE unit110 is accidentally removed from IF unit 120 in opening or closing ofMDE unit 110, and it is possible to ensure safety in installing basestation 100, for example, in a high place such as a utility pole.

Further, in base station 100, as shown in FIG. 16, fall prevention cap1404 prevents MDE unit hinge pin 1144 engaged in IF unit hinge 1202 frombeing removed from IF unit hinge 1202, and it is thereby possible tofurther improve safety in attaching or detaching MDE unit 110 to/from IFunit 120.

In base station 100, since MDE unit 110 is provided with CNT board P1constituting modulation and demodulation equipment to modulate anddemodulate transmission and reception signals, TRX board P2, BB0 boardP3 and BB1 board P4, it is possible to readily exchange the modulationand demodulation equipment apt to suffer effects of heat and cause aninfant mortality failure and communication failure due to a designerror, etc, and it is possible to perform startup, maintenance, andother operation of the system easier.

As shown in FIGS. 6 and 7, in base station 100, at least one connector,C8, among a plurality of connectors of motherboard 111 is a connectorfor use in attaching BB1 board P4 (printed-circuit board) for expansionfor the modulation and demodulation equipment, and it is thus possibleto readily increase the number of channels of the modulation anddemodulation equipment without operating IF unit 120.

In base station 100, as shown in FIGS. 28 and 29, attaching portions1216 and 1217 of main-body fixing members 160 and 161 used in fixing IFunit 120 to a predetermined installation portion are formed on the backof IF unit 120, and it is thus possible to beforehand fix IF unit 120 toa predetermined installation portion using main-body fixing members 160and 161 attached to attaching portions 1216 and 1217. Therefore,according to base station 100, IF unit 120 does not swing or fall inattaching or detaching MDE unit 110 to/from IF unit 120, and it ispossible to perform the operation of installing base station 100 safetyand promptly. In particular, in the case of installing base station 100in a high place such as a utility pole, IF unit 120 is beforehand fixedto an installtion portion using main-body fixing members 160 and 161,the operation is then carried out to attach MDE unit 110, and it isthereby possible to prevent occurrence of accidents such that IF unit120 falls in such operation. Further, according to this constitution,since main-body fixing members 160 and 161 are attached afterward toattaching portions 1216 and 1217 of IF unit 120, IF unit 120 of a stateprior to installation can be reduced in size and weight, and carry andpacking of IF unit 120 can be facilitated.

In IF unit 120 of base station 100 is formed ventilating opening 1218(see FIG. 3) of size capable of preventing liquid from entering byGore-Tex filter. Therefore, according to base station 100, since aircomes in and out through ventilating opening 1213, the internalatmospheric pressure inside MDE unit 110, IF unit 120 and T-PA unit 140is equal to the external atmospheric pressure, negative pressure doesnot occur inside base station 100, water and dust does not enter due tonegative pressure inside base station 100, and it is possible to improvewater resistance and dust resistance of base station 100.

As described above, motherboard 111 of base station 100 according tothis embodiment is configured so that the direction of attaching ordetaching connectors of CNT board P1, TRX board P2 and BB1 board P4respectively to/from connectors of motherboard 111 is the same as thedirection of attaching CNT board P1, TRX board P2 and BB1 board P4 toMDE case 114 of MDE unit 110. Therefore, according to base station 100,it is possible to attach CNT board P1, TRX board P2 and BB1 board P4 toMDE case 114 of MDE unit 110 without imposing stress on CNT board P1,TRX board P2 and BB1 board P4, with connectors of CNT board P1, TRXboard P2 and BB1 board P4 respectively connected to connectors ofmotherboard 111.

Thus, when motherboard 111 as described above is used, failures do notoccur due to stress caused by attaching to MDE case 111 MDE unit 110with printed-circuit boards such as CNT board P1, TRX board P2 and BB1board P4 attached to motherboard 111. Accordingly, in motherboard 111 ofbase station 100, it does not happen that an exchanged newprinted-circuit board causes the same failure again by the stress whenthe new printed-circuit board is exchanged and attached.

Further, motherboard 111 of base station 100 is configured so that BB1board P4 for expansion is provided in an exposed portion in such a statethat MDE cover 115 attached to MDE case 114 to be openable and closableis opened. Since BB1 board P4 is provided in such an exposed position,it is possible to readily perform the operation of attaching ordetaching BB1 board P4 to MDE unit 110.

Since base station 100 is provided with motherboard 111 with theaforementioned configuration, it is possible to construct acommunication system where failures hardly occur in CNT board P1, TRXboard P2 and BB1 board P4.

Further, as shown in FIG. 10, in base station 100, a ventilation path ofMDE fan 113 is formed between TRX board P2, BB0 board P3 and BB1 boardP4 formed of small-size printed-circuit boards and an inner wall of MDEcase 114 of MDE unit 110, and it is thus possible to efficiently cooleach of the printed-circuit boards arranged inside MDE unit 110 by MDEfan 113, and to suppress occurrence of failures due to heat in each ofthe printed-circuit boards.

Furthermore, in base station 100, a radiating member such as board plate116 as descried above can be provided to come into contact with CNTboard P1, TRX board P2, BB0 board P3 and BB1 board P4 provided in MDEunit 110, and it is thus possible to further suppress occurrence offailures due to heat in each of the printed-circuit boards.

Moreover, in base station 100, by using a heat pipe as the radiatingmember, it is possible to further improve the heat dissipationcharacteristics of CNT board P1, TRX board P2, BB0 board P3 and BB1board P4.

This application is based on the Japanese Patent Applications No.2003-168502 and No. 2003-168503 filed on Jun. 12, 2003, entire contentsof which are expressly incorporated by reference herein.

INDUSTRIAL APPLICABILITY

As described above, in the present invention, since an externalcontainer is divided, each external container is reduced in size andoperability is improved. Further, since heat dissipation space isprovided between divided external containers and a radiating member isprovided on an opposite face of each of the external containers, thepresent invention has a feature of extremely improving the heatdissipation characteristics, and is useful as a base station in acommunication system, in particular, a radio base transceiver station ina 3rd generation mobile communication system.

1. A base station, wherein an external container is divided into a firstflat-type external container that is fixed to an installation place anda second flat-type external container that holds circuit boards and thatis detachably attached to the first external container, and the secondexternal container is disposed on the outside of the first externalcontainer with heat dissipation space provided therebetween.
 2. The basestation according to claim 1, wherein a radiating member is provided oneach of opposite faces of the first external container and the secondexternal container.
 3. The base station according to claim 2, whereinthe first external container holds a power supply.
 4. The base stationaccording to claim 1, wherein the first external container and thesecond external container each have the airtightness, whilecommunicating with each other in internal space thereof.
 5. The basestation according to claim 1, wherein a fan unit is provided on an upperface of the first external container, the fan unit absorbing air frombetween the first external container and the second external containerto discharge.
 6. The base station according to claim 1, furthercomprising: a motherboard which has a plurality of motherboardconnectors connected to respective printed-circuit board connectorsprovided in a plurality of printed-circuit boards, and which isconfigured so that the direction of attaching/detaching theprinted-circuit board connectors to/from the motherboard connectors isthe same as the direction of attaching the printed-circuit boards to theexternal container.
 7. The base station according to claim 6, furthercomprising: a cooling fan to control the temperature inside the externalcontainer to which the motherboard is attached, wherein printed-circuitboards with small areas are provided in a central portion of theexternal container among the plurality of printed-circuit boardsattached to the motherboard, and a ventilation path of the cooling fanis formed between the printed-circuit boards with small areas and theexternal container.
 8. The base station according to claim 6, furthercomprising: a radiating member that cools at least one of the pluralityof printed-circuit boards in a state where a plurality of theprinted-circuit board connectors are connected to the plurality ofmotherboard connectors.
 9. The base station according to claim 8,wherein the radiating member has a heat pipe.
 10. A base stationcomprising: a first external container that is fixed to an installationplace; and a second external container that holds a plurality of stackedcircuit boards and that is detachably attached to the first externalcontainer, wherein clearance for heat dissipation communicating withoutside air is provided between the first external container and thesecond external container, and the first external container and thesecond external container are provided opposite to each other in thedirection in which the circuit boards are laminated.
 11. The basestation according to claim 10, wherein a radiating member is provided oneach of opposite faces of the first external container and the secondexternal container.
 12. The base station according to claim 11, whereinthe first external container holds a power supply.
 13. The base stationaccording to claim 10, wherein the first external container and thesecond external container each have the airtightness, whilecommunicating with each other in internal space thereof.
 14. The basestation according to claim 10, wherein a fan unit is provided on anupper face of the first external container, the fan unit absorbing airfrom between the first external container and the second externalcontainer to discharge.
 15. The base station according to claim 10,further comprising: a motherboard in which is provided a plurality ofmotherboard connectors connected to respective printed-circuit boardconnectors provided in a plurality of printed-circuit boards, and whichis configured so that the direction of attaching/detaching theprinted-circuit board connectors to/from the motherboard connectors isthe same as the direction of attaching the printed-circuit boards to theexternal container.
 16. The base station according to claim 15, furthercomprising: a cooling fan to control the temperature inside the externalcontainer to which the motherboard is attached, wherein printed-circuitboards with small areas are provided in a central portion of theexternal container among the plurality of printed-circuit boardsattached to the motherboard, and a ventilation path of the cooling fanis formed between the printed-circuit boards with small areas and theexternal container.
 17. The base station according to claim 15, furthercomprising: a radiating member that cools at least one of the pluralityof printed-circuit boards in a state where a plurality of theprinted-circuit board connectors are connected to the plurality ofmother board connectors.
 18. The base station according to claim 17,wherein the radiating member has a heat pipe.
 19. A motherboard in whichis provided a plurality of motherboard connectors connected torespective printed-circuit board connectors provided in a plurality ofprinted-circuit boards attached to an external container, and which isconfigured in such a manner that the direction of attaching/detachingthe printed-circuit board connectors to/from the motherboard connectorsis the same as the direction of attaching the printed-circuit boards tothe external container except at least one of the printed-circuit boardsthat is attached in a direction perpendicular to the attachingdirection.
 20. The motherboard according to claim 19, wherein theplurality of printed-circuit boards is a CNT board constituting acontrol device in modulation and demodulation equipment to modulate anddemodulate transmission and reception signals, a TRX board constitutinga transmission and reception card, a BB0 board for standard equipmentconstituting a baseband signal processor, and a BB1 board for expansionconstituting a baseband signal processor.
 21. The motherboard accordingto claim 21, wherein the external container is comprised of an externalcontainer case and an external container cover attached to the externalcontainer case to be openalbe and closable, and the BB1 board forexpansion is provided in a portion where a radiating member is exposedwith the external container covered opened.